Electronic Packaging Techniques
Originally published in 1979
Body
Odetics Inc, Anaheim, CA, developed advanced stitchbonding and parallel gap welding processes for spacecraft applications, including equipment aboard the Space Shuttle. These processes help designers compress more components into less space; they also afford weight savings and lower production costs.
Full article: http://hdl.handle.net/hdl:2060/20070019713
Abstract
Odetics Inc, Anaheim, CA, developed advanced stitchbonding and parallel gap welding processes for spacecraft applications, including equipment aboard the Space Shuttle. These processes help designers compress more components into less space; they also afford weight savings and lower production costs.
Electronic Packaging Techniques
Electronic Packaging Techniques
